ASE and Powerchip Form Joint Venture to Provide Memory Semiconductor Package and Test Services
July 14 2006 - 6:00AM
PR Newswire (US)
TAIPEI, Taiwan, July 14 /Xinhua-PRNewswire-FirstCall/ -- Advanced
Semiconductor Engineering, Inc. (TAIEX: 2311; NYSE: ASX)
(hereinafter "ASE") and Powerchip Semiconductor Corp. (GTSM: 5346)
(hereinafter "Powerchip") today jointly announced that the two
companies will raise $50,000,000 USD and form Power ASE Technology,
Inc. in Taiwan. This newly established company will focus on memory
IC related package and testing services. ASE will contribute
$30,000,000 USD and Powerchip will contribute $20,000,000 USD. The
newly established company will lease approximately 6,800 square
meters of production space in ASE's Chungli Campus for future
production, and will start recruiting employees and installing
equipment. Mass production is currently scheduled for 4Q2006. "ASE
Group has historically focused on high-end core logic and ASIC
package and testing services without extensive involvement in the
memory semiconductor area. ", said Mr. Jason Chang, Chairman of ASE
Group. "We believe the DRAM industry has become more consolidated
than it was in previous cycles, with solid fundamentals, decreasing
imbalance between supply and demand, and lower cyclicality risk. We
expect the growth in demand for new generation DRAM and other
memory devices will accelerate as we enter a brand new product
cycle in personal computers. DRAM companies will align with backend
subcontractors to support their ramp up, instead of using
subcontractors as an overflow support. In addition, we expect the
flash memory market to grow in conjunction with demand for various
consumer appliances. This should reduce the risk of product
concentration for the memory semiconductor industry." Powerchip
Chairman, Dr. Frank Huang, stated that with the growing market for
high density data flash, worldwide demand for memory products has
begun another period of growth. Powerchip at the same time is
focusing on the production of DRAM and Flash products as well as on
expanding its capacity in order to meet market demand. Considering
that Powerchip already has three 12" Fabs that will be running at
full capacity within the 12 months, together with the construction
of Powerchip's four new fabs, to be located in CTSP's Houli park,
Powerchip will draw upon past successes and gain another source for
packaging and testing. Working together with ASE is an essential
factor for Powerchp's growth, and furthermore provides support for
Powerchip group's future growth. Chairman Chang continues, "This JV
creates a win-win solution for ASE and Powerchip. Adequate supply
of backend capacity will support Powerchip's growth. The new
company will make necessary investments in memory testing equipment
and leverage ASE's economy of scale in packaging capacity and
internal substrate capability. We believe that, with commitment
from Powerchip, one of the leading DRAM companies in the world, the
overall business risk for the new company will be significantly
reduced. ASE can also benefit from the expertise in memory testing
obtained from this venture to support the demand for memory testing
when we provide SIP and SOC solutions to our customers. This new
company enhances our coverage in IC package and testing, and we are
very excited about it." Jason Chang, the Chairman of ASE, will
serve as the Chairman of the new JV. Other members of the new JV's
management team will be appointed shortly. Safe Harbor Notice This
press release contains "forward-looking statements" within the
meaning of Section 27A of the Securities Act of 1933, as amended,
and Section 21E of the Securities Exchange Act of 1934, as amended.
Although these forward-looking statements, which may include
statements regarding our future results of operations, financial
condition or business prospects, are based on our own information
and information from other sources we believe to be reliable, you
should not place undue reliance on these forward-looking
statements, which apply only as of the date of this press release.
The words "anticipate", "believe", "estimate", "expect", "intend",
"plan" and similar expressions, as they relate to us, are intended
to identify these forward- looking statements in this press
release. Our actual results of operations, financial condition or
business prospects may differ materially from those expressed or
implied in these forward-looking statements for a variety of
reasons, including risks associated with cyclicality and market
conditions in the semiconductor industry; demand for the outsourced
semiconductor packaging and testing services we offer and for such
outsourced services generally; the highly competitive semiconductor
industry; our ability to introduce new packaging, interconnect
materials and testing technologies in order to remain competitive;
our ability to successfully integrate pending and future mergers
and acquisitions; international business activities; our business
strategy; general economic and political conditions; possible
disruptions in commercial activities caused by natural or
human-induced disasters; our future expansion plans and capital
expenditures; the strained relationship between the Republic of
China and the People's Republic of China; fluctuations in foreign
currency exchange rates; and other factors. For a discussion of
these risks and other factors, please see the documents we file
from time to time with the Securities and Exchange Commission,
including our 2005 Annual Report on Form 20-F filed on June 19,
2006. Contact: ASE, Inc. Powerchip Semiconductor Corp. Room 1901,
No. 333, Section 1 15F, 68, Sec. 3, Nanking East Road Keelung Road,
Taipei, Taiwan, 110 Taipei, Taiwan Freddie Liu, Financial
Controller Eric Tang, Vice President/Spokesperson Tel:
+886-2-8780-5489 Fax: +886-2-2757-6121 Tel: +886-2-2517-0055
http://www.aseglobal.com/ Fax: +886-2-2517-9208
http://www.psc.com.tw/ DATASOURCE: Advanced Semiconductor
Engineering, Inc.; CONTACT: Freddie Liu of ASE, Inc.,
+886-2-8780-5489, or fax, +886-2- 2757-6121, , or Eric Tang of
Powerchip Semiconductor Corp., +886-2-2517-0055, or fax,
+886-2-2517-9208, or
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