FREMONT,
Calif., Jan. 29, 2025 /PRNewswire/ -- Lam Research
Corporation (Nasdaq: LRCX) today announced that Aether®, its
innovative dry photoresist technology, has been selected by a
leading memory manufacturer as production tool of record for the
most advanced DRAM processes. A breakthrough introduced by Lam in
2020, dry resist extends the resolution, productivity, and yield of
Extreme Ultraviolet (EUV) lithography, a pivotal technology used in
the production of next-generation semiconductor devices.
Lam's dry resist approach overcomes the
biggest challenges of transferring fine DRAM designs to a
wafer.
"Lam's dry resist approach overcomes the biggest challenges of
transferring fine DRAM designs to a wafer, delivering low-defect,
high fidelity precision, while also offering key advantages in cost
and sustainability," said Vahid
Vahedi, chief technology and sustainability officer at Lam
Research. "We are proud to collaborate with industry leaders to
accelerate this DRAM patterning innovation into high-volume
manufacturing."
The memory manufacturer will employ the Aether® tools in its
most advanced DRAM nodes to form dry resist underlayers and films,
and to use dry development processes. These processes overcome the
traditional tradeoff between exposure dose and manufacturing
defectivity to enable precise, low-defect patterning. This
advancement drives down costs and enhances scanner productivity in
the manufacturing of next-generation semiconductor devices.
Energy and compute intensive applications require continued
scaling of memory capacity in an ever-smaller footprint to enable
lower cost per bit of data. A key enabler of this scaling is
industry-wide adoption of EUV lithography. Lam's dry photoresist
technologies optimize the patterning process from resist
application and stack deposition through final etching and
cleaning, offering several advantages over conventional chemically
amplified resist patterning.
Aether® significantly enhances EUV sensitivity and the
resolution of each wafer pass, enabling the most challenging
patterns to better adhere to the wafer and improving performance
and yield. In addition, it offers key sustainability benefits by
consuming less energy and five to ten times less chemicals than
traditional wet chemical resist processes.
About Lam Research
Lam Research Corporation is a
global supplier of innovative wafer fabrication equipment and
services to the semiconductor industry. Lam's equipment and
services allow customers to build smaller and better performing
devices. In fact, today, nearly every advanced chip is built with
Lam technology. We combine superior systems engineering, technology
leadership, and a strong values-based culture, with an unwavering
commitment to our customers. Lam Research (Nasdaq: LRCX) is a
FORTUNE 500® company headquartered in Fremont, Calif., with operations around the
globe. Learn more at www.lamresearch.com.
Caution Regarding Forward-Looking
Statements
Statements made in this press release
that are not of historical fact are forward-looking statements and
are subject to the safe harbor provisions created by the Private
Securities Litigation Reform Act of 1995. Such forward-looking
statements relate to, but are not limited to: industry and market
trends and expectations; customer adoption and usage of Lam
products; and product performance, including technical, cost and
sustainability benefits. Some factors that may affect these
forward-looking statements include: the actions of our customers
and competitors may be inconsistent with our expectations;
business, political and/or regulatory conditions in the consumer
electronics industry, the semiconductor industry and the overall
economy may deteriorate or change; trade regulations, export
controls, trade disputes, and other geopolitical tensions may
inhibit our ability to sell our products; supply chain cost
increases and other inflationary pressures have impacted and may
continue to impact our profitability; supply chain disruptions or
manufacturing capacity constraints may limit our ability to
manufacture and sell our products; and natural and human-caused
disasters, disease outbreaks, war, terrorism, political or
governmental unrest or instability, or other events beyond our
control may impact our operations and revenue in affected areas; as
well as the other risks and uncertainties that are described in the
documents filed or furnished by us with the Securities and Exchange
Commission, including specifically the Risk Factors described in
our annual report on Form 10-K for the fiscal year ended
June 30, 2024 and our quarterly
report on Form 10-Q for the fiscal quarter ended September 29, 2024. These uncertainties and
changes could materially affect the forward-looking statements and
cause actual results to vary from expectations in a material way.
The Company undertakes no obligation to update the information or
statements made in this release.
Company Contacts:
Allison L. Parker
Media Relations
(510) 572-9324
publicrelations@lamresearch.com
Ram Ganesh
Investor Relations
(510) 572-1615
investor.relations@lamresearch.com
Source: Lam Research Corporation, (Nasdaq: LRCX)
View original content to download
multimedia:https://www.prnewswire.com/news-releases/breakthrough-euv-dry-photoresist-technology-from-lam-research-adopted-by-leading-memory-manufacturer-302363785.html
SOURCE Lam Research Corporation
