NEW YORK, Aug. 6, 2024 /PRNewswire/ -- The
global semiconductor assembly and testing services (SATS)
market size is estimated to grow by USD
19.31 billion from 2024-2028, according to Technavio. The
market is estimated to grow at a CAGR of 6.59% during the forecast
period. Rising sales of iot devices is driving market growth,
with a trend towards advances in SATS. However, intense competition
in sats industry poses a challenge. Key market players include
Amkor Technology Inc., Aptasic SA, ASE Technology Holding Co. Ltd.,
ChipMOS TECHNOLOGIES INC., DPA Components International,
Flexitallic Group, Formosa Advanced Technologies Co. Ltd.,
GlobalFoundaries Inc., Jiangsu Changdian Technology Co. Ltd., King
Yuan Electronics Co. Ltd., Koninklijke Philips N.V., Micross Inc.,
Ose Corp., Powertech Technology Inc., Rochester Electronics LLC,
Teledyne Technologies Inc., Tianshui Huatian Technology Co. Ltd.,
Unisem M Berhad, UTAC Holdings Ltd., and Walton Advanced
Engineering Inc..
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Semiconductor
Assembly And Testing Services (SATS) Market Scope
|
Report
Coverage
|
Details
|
Base year
|
2023
|
Historic
period
|
2018 - 2022
|
Forecast
period
|
2024-2028
|
Growth momentum &
CAGR
|
Accelerate at a CAGR of
6.59%
|
Market growth
2024-2028
|
USD 19310.4
million
|
Market
structure
|
Fragmented
|
YoY growth 2022-2023
(%)
|
6.18
|
Regional
analysis
|
APAC, North America,
Europe, South America, and Middle East and Africa
|
Performing market
contribution
|
APAC at 76%
|
Key
countries
|
South Korea, Taiwan,
China, US, and Japan
|
Key companies
profiled
|
Amkor Technology Inc.,
Aptasic SA, ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES
INC., DPA Components International, Flexitallic Group, Formosa
Advanced Technologies Co. Ltd., GlobalFoundaries Inc., Jiangsu
Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd.,
Koninklijke Philips N.V., Micross Inc., Ose Corp., Powertech
Technology Inc., Rochester Electronics LLC, Teledyne Technologies
Inc., Tianshui Huatian Technology Co. Ltd., Unisem M Berhad, UTAC
Holdings Ltd., and Walton Advanced Engineering Inc.
|
Market Driver
The semiconductor assembly and testing services (SATS) market
has experienced significant growth due to advancements in chip
packaging technologies. One such innovation is 3D IC packaging,
which allows for miniaturized ICs and the stacking of intelligence
centers, addressing space constraints. Organic-substrate-interposer
technology is also popular due to its cost-effectiveness compared
to silicon interposers. Another technology, TSV or
silicon-via-interconnection, is used for creating 3D packages and
integrated 3D circuits, enabling increased performance and reduced
product costs. TSVs are also utilized in complementary metal-oxide
semiconductor (CIS) image sensors, allowing for reduced form
factors and high-density interconnects. These advancements are
anticipated to fuel the expansion of the global SATS market in the
forecast period.
The Semiconductor Assembly and Testing Services (SATS) market is
experiencing significant trends in the electronics industry. With
the rise of network connectivity in various applications, there is
an increasing demand for semiconductor components in smart homes,
smart television sets, smartphones, tablets, telecommunication, and
5G technologies. Outsourcing SATS to service providers ensures
operational efficiency and cost savings. Advanced packaging
technologies, such as wire bonding and 3D semiconductor assemblies,
enhance product quality and reliability. Power efficiency and
resistance to thermal cycling are crucial for the production of
power-efficient devices and safety systems. Reliability testing,
including burn-in and accelerated stress testing, is essential for
ensuring the longevity and dependability of semiconductor
components and chipsets (ICs). The automotive industry is also
embracing semiconductors for automotive electronics and systems,
requiring stringent certifications. Semiconductor manufacturing,
including wafer fabrication factories, must maintain prudence and
flexibility to adapt to process complexity and the paradigm shift
towards miniaturization and higher integration. The semiconductor
industry's focus on quality and reliability is driving innovation
in chip design, chipsets, cloud services, and 5G technology for
wireless networks.
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Market Challenges
- The Semiconductor Assembly and Testing Services (SATS) industry
is a highly competitive and capital-intensive market. Consolidation
among players over the last decade improved cost performance, but
the industry faces challenges from shortening product lifecycles
and advancing technology. Additionally, rising energy prices and
volatile commodity costs add to the pressures. Most SATS businesses
are located in emerging economies with low labor costs and limited
use of advanced manufacturing techniques. While front-end silicon
wafer manufacturers adopt lean techniques and digitalization,
backend SATS businesses lag in these implementations. Lean
manufacturing minimizes waste and increases efficiency, while IoT
enhances operational efficiency and reduces delivery times. The
global SATS market has a few major players accounting for over half
the revenue, leaving smaller companies with low economies of scale
and impacting their margins and growth. R&D costs are
significant in the SATS market, enabling major players to invest in
proprietary processes and designs, creating a challenge for smaller
competitors. Further competition may come from pure-play foundries
and IDMs expanding into SATS, potentially intensifying market
competition and hindering growth during the forecast period.
- The Semiconductor Assembly and Testing Services (SATS) market
faces several challenges in today's technology landscape. With the
rise of 3D semiconductor assemblies and the integration of 5G
technologies into 5G wireless networks, advanced packaging
technologies are in high demand. Automotive electronics and systems
require specialized testing for certifications, such as
conductivity and emission reduction, for use in electrification and
fuel efficiency. Chip design and IC chipset assembly for consumer
electronics, computing industry, communication industry, and
industrial applications require accelerated stress testing and
electrical characterization. Environmental testing, including
burn-in and conductivity, is crucial for reliability in various
applications. Additionally, industry standards for data transfer
speeds, low thermal ratings, and encapsulation are essential for
the manufacturing of chipsets (ICs) and electronic components in
cloud services, entertainment systems, navigation, and the Internet
of Things. Metals and insulators play a vital role in the
fabrication process, ensuring efficient production and high-quality
products.
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Segment Overview
This semiconductor assembly and testing services (sats) market
report extensively covers market segmentation by
- Application
- 1.1 Communication
- 1.2 Computing and networking
- 1.3 Industrial
- 1.4 Consumer electronics
- 1.5 Automotive electronics
- Service Type
- 2.1 Assembly services
- 2.2 Testing services
- Geography
- 3.1 APAC
- 3.2 North America
- 3.3 Europe
- 3.4 South America
- 3.5 Middle East and
Africa
1.1 Communication- Semiconductor Assembly and Testing
Services (SATS) play a vital role in the communication segment by
providing essential components and services for the production of
communication devices. In this sector, semiconductor components,
including ICs, power amplifiers, and filters, are necessary for
signal amplification, filtering, and modulation, which are crucial
for data and voice transmission over networks. SATS contribute
significantly to the manufacturing of communication devices by
supplying high-quality components and offering testing services to
ensure compliance with industry standards. Communication devices
such as smartphones, radios, modems, and routers require rigorous
testing and quality assurance to meet regulatory bodies' safety,
performance, and quality standards, such as the Federal
Communications Commission (FCC) and the International Organization
for Standardization (ISO). Moreover, SATS offer customization
services for communication devices, designing customized ICs and
modifying existing components to optimize their performance with
the device. Quality assurance is a top priority for SATS, ensuring
devices meet durability, reliability, and functionality
requirements. The communication segment's growth in Internet of
Things (IoT) devices and wireless communication technology
necessitates the use of advanced semiconductor components. SATS
provide components supporting these technologies, including ICs,
sensors, and modules, and offer testing services to ensure their
proper functionality and adherence to required standards. Overall,
the above factors are expected to fuel the growth of the global
SATS market through the communication segment during the forecast
period.
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The global Semiconductor Market is set for significant growth,
driven by advancements in technology and increasing demand across
various sectors. Key segments include consumer electronics,
automotive, and industrial applications. The global Semiconductor
Advanced Packaging Market is also expanding rapidly, with
innovative packaging technologies enhancing performance and
reliability. This market's growth is fueled by the rising
complexity of semiconductor devices and the need for
miniaturization. Both markets are expected to witness robust growth
due to technological advancements and evolving consumer needs.
Research Analysis
The Semiconductor Assembly and Testing Services (SATS) market
encompasses the processes and services involved in the production
of integrated circuits and chipsets. These processes include
conductivity testing, where the conductivity of conductors and
insulators is measured using metals and resistance. SATS plays a
crucial role in the semiconductor manufacturing industry, ensuring
the quality and reliability of advanced packaging technologies used
in various applications. SATS is essential for the production of
power-efficient devices, such as those used in mobile devices,
Internet of Things (IoT) applications, automotive electronics, and
electrification systems. Advanced testing techniques, including
electrical characterization and environmental testing, are employed
to ensure the optimal performance of these devices. SATS also plays
a significant role in the development of new technologies, such as
3D semiconductor assemblies, 5G technology, and cloud services. The
market is driven by the growing demand for miniaturization, power
efficiency, and high-speed connectivity in various industries. The
focus on producing smaller, more reliable, and more efficient
semiconductor components is a key trend in the SATS market.
Market Research Overview
The Semiconductor Assembly and Testing Services (SATS) market
encompasses various processes and services essential to the
production of semiconductor components. These services include 3D
semiconductor assemblies, advanced packaging technologies, and
electrical characterization. The market caters to numerous
industries, such as automotive electronics, communication, and
computing, driven by the paradigm shift towards 5G technologies and
the Internet of Things. SATS involve processes like die
preparation, wafer fabrication, and IC chipset assembly, as well as
testing services such as burn-in, reliability, and environmental
testing. The market also focuses on outsourcing and industry
standards to ensure product quality and operational efficiency.
Semiconductor components, including chipsets (ICs), conductors,
insulators, and metals, undergo various stages of fabrication and
packaging, including encapsulation, electrification, and thermal
cycling. The market caters to diverse applications, from consumer
electronics like mobile devices, smartphones, tablets, and smart
television sets to industrial applications and safety systems. SATS
providers offer services to various sectors, including automotive
systems, computing industry, information technology, and
telecommunication, ensuring prudence and flexibility in meeting
their clients' needs. The market's growth is fueled by the demand
for power-efficient devices, low thermal ratings, and high data
transfer speeds, making it a crucial player in the semiconductor
manufacturing landscape.
Table of Contents:
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation
- Application
-
- Communication
- Computing And Networking
- Industrial
- Consumer Electronics
- Automotive Electronics
- Service Type
-
- Assembly Services
- Testing Services
- Geography
-
- APAC
- North America
- Europe
- South America
- Middle East And Africa
7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix
About Technavio
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