Broadcom Extends Technology and Volume Leadership on AI Optical Components
March 13 2024 - 8:00AM
Broadcom Inc. (NASDAQ: AVGO), the world’s leading provider of fiber
optic components for optical networking and communications,
today announced several major accomplishments extending its
market leadership with an expanded portfolio of optical
interconnect solutions for artificial intelligence (AI) and machine
learning (ML) applications. Broadcom’s state-of-the-art optics
technologies facilitate high speed interconnects for front-end and
back-end networks of large-scale generative AI compute clusters.
Key Announcement Highlights:
- Production release of 200-Gbps per lane (200G/lane)
electro-absorption modulated laser (EML) to pair with next
generation GPUs
- Demonstration of the industry’s first 200G/lane vertical-cavity
surface-emitting laser (VCSEL)
- Demonstration of continuous wave (CW) laser with high
efficiency and high linearity for silicon photonics (SiPh)
modulation at 200G
- Shipment of more than 20 million channels of 100G/lane high
speed optical components used in AI/ML systems
VCSEL and EML technologies play a crucial role in enabling
high-speed interconnects for AI and ML systems. Broadcom’s 200G
VCSEL and EML products follow up on successful deployment of
100G/lane VCSEL and EML chips into first-generation generative AI
networks and will provide unrivaled bandwidth and interconnect
density for next generation interconnects. Both product
families from Broadcom represent trusted and reliable technologies
that will enable integration partners to use existing capacity as
end users progress to 1.6T optical transceivers and usher in the
era of terabit connectivity.
“Generative AI has unleashed a network transformation
necessitating an order of magnitude increase in high-speed optical
links compared to standard network requirements,” said Near
Margalit, Ph. D., vice president and general manager of the Optical
Systems Division at Broadcom. “We will continue to invest in VCSEL,
EML and CW laser technologies to deliver disruptive innovation in
bandwidth, power and latency for optical interconnects in next
generation AI links.”
“We expect shipments of 8x100G optical transceivers to exceed 5
million units in 2024 and first 8x200G modules delivered to
customers by the end of the year,” commented Dr. Vladimir Kozlov,
founder and CEO of LightCounting Market Research. “Google and
Nvidia will be the first adopters of 200G per lane optics for
interconnecting GPUs and TPUs in AI Clusters – the hottest area of
the market now. Broadcom is once again among the first suppliers of
components enabling the next generation of optical
transceivers.”
“Enterprises continue to demand larger AI clusters, elevating
the importance of cutting-edge optical interconnects,” said Craig
Thompson, vice president of LinkX products at NVIDIA. “NVIDIA is at
the forefront of photonics innovation, and Broadcom has been an
important optical-component partner, matching the pace and scale
required as we advance our HPC and AI optical-interconnect
technology.”
“At Innolight, we have been deploying leading-edge optical
interconnect solutions for AI, ML and HPC applications,” said Osa
Mok, chief marketing officer (CMO) at Innolight Technology. “We are
excited to continue our partnership with Broadcom to develop
advanced terabit optical modules for generative AI, enabling AI
clusters to scale and support the next generation of LLMs.”
“Eoptolink is deeply invested in AI/ML optical transceiver
technologies with a broad portfolio of advanced high-speed module
offerings,” said Sean Davies, vice president of sales at Eoptolink
Technology. “We are excited to partner with Broadcom to bring to
market state-of-the-art solutions to enable terabit connectivity
and drive new generative AI architectures.”
Demo Showcase at OFC 2024
Broadcom will showcase the following products and
technologies:
- 200G VCSEL technology demonstration
- 200G EML product demonstration
- 200G SiPh modulation with CW lasers
- 100G VCSELs for emerging applications including server
interconnect, PCIe interconnect and next generation Fibre
Channel
These demonstrations will be in the Broadcom Booth 5325 at the
Optical Fiber Communication (OFC) 2024 exhibition in San Diego,
California from March 26th to 28th.
About BroadcomBroadcom Inc. (NASDAQ: AVGO)
is a global technology leader that designs, develops, and supplies
a broad range of semiconductor, enterprise software and security
solutions. Broadcom's category-leading product portfolio serves
critical markets including cloud, data center, networking,
broadband, wireless, storage, industrial, and enterprise software.
Our solutions include service provider and enterprise networking
and storage, mobile device and broadband connectivity, mainframe,
cybersecurity, and private and hybrid cloud infrastructure.
Broadcom is a Delaware corporation headquartered
in Palo Alto, CA. For more information, go
to www.broadcom.com.
Broadcom, the pulse logo, and Connecting everything are among
the trademarks of Broadcom. The term "Broadcom" refers to Broadcom
Inc., and/or its subsidiaries. Other trademarks are the property of
their respective owners.
Press Contact: Khanh Lam
Corporate Communicationspress.relations@broadcom.com
Telephone: +1 408 433 8649
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