ST. FLORIAN, Austria, March 14,
2018 /PRNewswire/ -- EV Group (EVG), a leading
supplier of wafer bonding and lithography equipment for the MEMS,
nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today
announced that the companies agreed to sign a license agreement on
laser debonding technology. EVG plans to integrate IBM's patented
Hybrid Laser Release process into EVG's advanced, field-proven
temporary bonding and debonding equipment solutions, which can
provide high-volume manufacturers with greater flexibility to
implement optimized temporary bonding and debonding process flows.
Thanks to the added process variants from IBM that will be
supported by EVG's equipment portfolio, customers can choose from a
wide range of bonding, cleaning and metrology process options to
help address their temporary bonding and debonding requirements and
applications.
The result, which is an advanced laser debonding solution based
on EVG's combination of the technology licensed from IBM with EVG's
know-how, encompasses methods and designs for UV and IR laser
debonding (designed to enable the use of glass or silicon carriers)
as well as inspection of the bond interfaces. The technologies
contributed by IBM help EVG implement designs that address the
industry's critical requirements for temporary bonding and
debonding, including high throughput, low wafer stress for high
yield, and low cost of ownership of the laser equipment, processing
and consumables. The advanced EVG solution encompasses techniques
to help protect chips from heat and laser damage, as well as
chemical clean technologies for device and carrier
wafers.
"This agreement with IBM enables EV Group to provide a
comprehensive and flexible technology offering to our high-volume
production customers that can enable them to produce value-added
devices at greater flexibility, throughput and cost-efficiency,"
said Markus Wimplinger, EVG's corporate technology development and
IP director.
"The laser debonding technology using glass or silicon carrier
wafers can provide prototyping through high throughput
manufacturing efficiency, a low cost of ownership, and a
miniaturization platform. A growing range of fabrication
demonstrations and applications supported include mobile phones,
healthcare and IoT micro-systems, sensors and miniaturized size
components handling, bio-sensors, bio-chips and diagnostics
systems, and artificial intelligence solutions," said Dr.
John Knickerbocker, Manager,
Micro-Systems Technology & Solutions, IBM Research.
Designed for integration in the company's benchmark
EVG®850DB automated debonding system, EVG's laser
debonding modules incorporate a solid-state laser and proprietary
beam-shaping optics designed to enable optimized, force-free
debonding. Featuring both low-temperature debonding and
high-temperature-processing stability, EVG's laser debonding
solution is available for a variety of applications. These include
fan-out wafer-level packaging (FO-WLP) and other
temperature-sensitive processes such as memory stacking and
integration, die-partitioning, heterogeneous integration and
bio-technology / organic packages and devices applications, as well
as photonics, compound semiconductors and power devices.
More information on EV Group's laser debonding solutions and the
EVG850DB automated debonding system are also available at:
https://www.evgroup.com/en/solutions/3d-ic/thin_wafer_processing/laser_initiated_debonding
About EV Group (EVG)
EV Group (EVG) is a leading
supplier of equipment and process solutions for the manufacture of
semiconductors, microelectromechanical systems (MEMS), compound
semiconductors, power devices and nanotechnology devices. Key
products include wafer bonding, thin-wafer processing,
lithography/nanoimprint lithography (NIL) and metrology equipment,
as well as photoresist coaters, cleaners and inspection systems.
Founded in 1980, EV Group services and supports an elaborate
network of global customers and partners all over the world. More
information about EVG is available at www.EVGroup.com.
EV Group
Contacts:
|
|
Clemens
Schütte
|
David
Moreno
|
Director, Marketing
and Communications
|
Principal
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EV Group
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Open Sky
Communications
|
Tel: +43 7712 5311
0
|
Tel:
+1.415.519.3915
|
E-mail:
Marketing@EVGroup.com
|
E-mail:
dmoreno@openskypr.com
|
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SOURCE EV Group