TSMC Launches Automotive Process Qualification Specification and Service Package in China Market
November 27 2009 - 2:00AM
PR Newswire (US)
TSMC Commits to China Automotive Excellence by Meeting AEC
Guidelines HSINCHU, Taiwan, R.O.C., Nov. 27 /PRNewswire-FirstCall/
-- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330,
NYSE: TSM) today announced that it plans to launch the automotive
industry's first process qualification specification and service
package for automotive-grade semiconductor manufacturing at the
China IC Design Conference being held in Xiamen on December 2. The
company also announced that its Fab 10, located in Shanghai, is
prepared to manufacture automotive grade ICs. The automotive
process qualification specification, made broadly public today, was
first proposed at the Automotive Electronic Council's (AEC) annual
Reliability Workshop in June 2008. Semiconductor devices in
automobiles wear out quickly due to the stringent operating
environment, and it is critical that the inherent manufacturing
process can support semiconductor devices that will last far beyond
the vehicle's lifetime. TSMC has also developed a comprehensive
Automotive Service Package to complement customers' test coverage
and test methodology to reduce the field failure rate. TSMC
Automotive Service Package incorporate tightened process control,
device level screen limit, and wafer sorting scrap criteria,
additional SPC monitoring, preferred tools, etc. It significantly
reduces process variation and outliers. "Integrated circuits of all
types are playing a larger role in the automotive industry. Our
commitment is to support automotive IC technology including
innovations that are taking place in China," said Jason Chen, Vice
President, Worldwide Sales and Marketing, TSMC. "We are backing
this commitment with action by dedicating our efforts at Fab 10 in
Shanghai to accelerate the growth of China's automotive present and
future." TSMC Fab 10 in Shanghai, along with multiple fabs in
Taiwan, has successfully established the capability of supporting
the automotive service package. The automotive process route in Fab
10 is available for global auto supply chain companies, including
those in China. About TSMC TSMC is the world's largest dedicated
semiconductor foundry, providing the industry's leading process
technology and the foundry's largest portfolio of process-proven
libraries, IP, design tools and reference flows. The Company's
total managed capacity in 2008 exceeded 9 million 8-inch equivalent
wafers, including capacity from two advanced 12-inch -
GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as
TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and
its joint venture fab, SSMC. TSMC is the first foundry to provide
40nm production capabilities. Its corporate headquarters are in
Hsinchu, Taiwan. For more information about TSMC please visit
http://www.tsmc.com/. DATASOURCE: TSMC CONTACT: Ferda Mehmet,
A&R Edelman, +1-650-762-2946, Mobile: +1-415-308-7877; or
Michael Kramer, Corporate Public Relations, 886-3-5636688 ext:
7126216 Web Site: http://www.tsmc.com/
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