News highlights:
- TI enhances detection accuracy with the industry's first
single-chip 60GHz millimeter-wave (mmWave) radar sensor to support
three in-cabin sensing applications enabled by edge artificial
intelligence (AI).
- Auto manufacturers can deliver premium audio experiences with a
highly integrated automotive Arm®-based microcontroller (MCU) and
processor with TI's vector-based C7x digital signal processor (DSP)
core to achieve industry-leading processor performance.
- TI's new audio amplifier is the industry's first with
one-inductor (1L) modulation technology, allowing it to achieve
Class-D performance with half the number of inductors.
DALLAS, Jan. 6, 2025
/PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today
introduced new integrated automotive chips to enable safer, more
immersive driving experiences at any vehicle price point. TI's
AWRL6844 60GHz mmWave radar sensor supports occupancy monitoring
for seat belt reminder systems, child presence detection and
intrusion detection with a single chip running edge AI algorithms,
enabling a safer driving environment. With TI's next-generation
audio DSP core, the AM275x-Q1 MCUs and AM62D-Q1 processors make
premium audio features more affordable. Paired with TI's latest
analog products, including the TAS6754-Q1 Class-D audio amplifier,
engineers can take advantage of a complete audio amplifier system
offering. TI is showcasing these devices at the 2025 Consumer
Electronics Show (CES), Jan. 7-10, in
Las Vegas, Nevada.
For more information, see ti.com/AWRL6844, ti.com/AM2754-Q1,
ti.com/AM62D-Q1 and ti.com/TAS6754-Q1.
"Today's drivers expect any car – entry-level to luxury,
combustion to electric – to have enhanced in-cabin experiences,"
said Amichai Ron, senior vice
president, TI Embedded Processing. "TI continues to provide
innovative technologies to enable the future of the automotive
driving experience. Our edge AI-enabled radar sensors allow
automakers to make vehicles safer and more responsive to the
driver, while our audio systems-on-chip elevate the drive through
more immersive audio. Together they create a whole new level of
in-cabin experiences."
Edge AI-enabled, three-in-one radar sensor increases
detection accuracy
Original equipment manufacturers (OEMs)
are gradually designing in more sensors to enhance the in-vehicle
experience and meet evolving safety standards. TI's edge AI-enabled
AWRL6844 60GHz mmWave radar sensor enables engineers to incorporate
three in-cabin sensing features to replace multiple sensor
technologies, such as in-seat weight mats and ultrasonic sensors,
lowering total implementation costs by an average of US$20 per vehicle.
The AWRL6844 integrates four transmitters and four receivers,
enabling high-resolution sensing data at an optimized cost for
OEMs. This data feeds into application-specific AI-driven
algorithms on a customizable on-chip hardware accelerator and DSP,
improving decision-making accuracy and reducing processing time.
The edge intelligence capabilities of the AWRL6844 sensor that help
improve the driving experience include these examples:
- While driving, it supports occupant detection and localization
with 98% accuracy to enable seat belt reminders.
- After parking, it monitors for unattended children in the
vehicle, using neural networks that detect micromovements in real
time with over 90% classification accuracy. This direct sensing
capability enables OEMs to meet 2025 European New Car Assessment
Program (Euro NCAP) design requirements.
- When parked, it adapts to different environments through
intelligent scanning, reducing false intrusion detection alerts
caused by car shaking and external movement.
To learn more, read the technical article, "Reducing
In-Cabin Sensing Complexity and Cost with a Single-Chip 60GHz
mmWave Radar Sensor."
Deliver premium automotive audio with TI's complete audio
portfolio
As driver expectations grow for elevated in-cabin
experiences across vehicle models, OEMs aim to offer premium audio
while minimizing design complexity and system cost. AM275x-Q1 MCUs
and AM62D-Q1 processors reduce the number of components required
for an automotive audio amplifier system by integrating TI's
vector-based C7x DSP core, Arm cores, memory, audio networking and
a hardware security module into a single, functional safety-capable
SoC. The C7x core, coupled with a matrix multiply accelerator,
together form a neural processing unit that processes both
traditional and edge AI-based audio algorithms. These automotive
audio SoCs are scalable, allowing designers to meet memory and
performance needs, from entry-level to high-end systems, with
minimal redesign and investment.
TI's next-generation C7x DSP core achieves more than four times
the processing performance of other audio DSPs, allowing audio
engineers to manage multiple features within a single core.
AM275x-Q1 MCUs and AM62D-Q1 processors enable immersive audio
inside the cabin with features such as spatial audio, active noise
cancellation, sound synthesis and advanced vehicle networking,
including Audio Video Bridging over Ethernet.
"Dolby's longtime collaboration with Texas Instruments has
enabled incredible audio experiences in the home, which we're now
bringing into the car," said Andreas
Ehret, senior director of Automotive Business at Dolby
Laboratories. "With TI's C7x DSP core, we can now deliver the
latest Dolby Atmos capabilities more efficiently, including support
for even smaller form factor audio systems so nearly all vehicles
can have Dolby Atmos. Together, these products can help turn every
car ride into an immersive entertainment experience."
To further optimize their automotive audio designs, engineers
can use TI's TAS6754-Q1 audio amplifier with innovative 1L
modulation technology to deliver class-leading audio
performance and power consumption, with half the number of
inductors compared to existing Class-D amplifiers. The TAS67xx-Q1
family of devices, which integrates real-time load diagnostics
required by OEMs, helps engineers simplify designs, decrease costs,
and increase efficiency without sacrificing audio quality.
To learn more, read the company blog, "Redefining the commute:
The advanced audio technology transforming your drive."
TI at CES 2025
At CES 2025, TI will demonstrate how
semiconductor technologies make it possible to reimagine
experiences everywhere by enabling new levels of automation,
intelligence, power efficiency and affordability. Demonstrations
include innovations in software-defined vehicles, advanced
driver-assistance systems, robotics, medical wearables, energy
infrastructure and personal electronics. See ti.com/CES for
more information.
- Tuesday, Jan. 7 through
Friday, Jan. 10: Visit TI in the
Las Vegas Convention Center North
Hall, meeting room No. N116.
- Thursday, Jan. 9 at 4 p.m.
Pacific Standard time: Fern
Yoon will participate in "The Road Ahead: Software Defined
Vehicles."
Package, availability and pricing
- Preproduction quantities of the AWRL6844, AM2754-Q1, AM62D-Q1
and TAS6754-Q1 are available for purchase now on TI.com.
- Multiple payment and shipping options are available.
- Evaluation modules are available for all four devices.
About Texas Instruments
Texas Instruments Incorporated
(Nasdaq: TXN) is a global semiconductor company that designs,
manufactures and sells analog and embedded processing chips for
markets such as industrial, automotive, personal electronics,
communications equipment and enterprise systems. At our core, we
have a passion to create a better world by making electronics more
affordable through semiconductors. This passion is alive today as
each generation of innovation builds upon the last to make our
technology more reliable, more affordable and lower power, making
it possible for semiconductors to go into electronics everywhere.
Learn more at TI.com.
Trademarks
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trademarks belong to their respective owners.
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